Silicon to system, under one roof.
Most contract manufacturers assemble what you hand them. DMTech architects the silicon, the radio, the signal path, the firmware, and the mechanicals — then builds and tests the device on the same floor.
Silicon & ASIC architecture
Chief Architect · Lead ASIC Architect
SoC and ASIC architecture, product definition through silicon validation, and ARM-based system integration for embedded medical platforms. Our architects have led design programs behind profitable multimedia, smartphone, and SSD platforms shipped at scale.
For a medical device, this means the core of your system is defined by people who will also live with its manufacturing and test consequences — silicon choices made with the production line, ATE program, and BOM in view from day one.
- SoC architecture
- ARM integration
- Silicon bring-up
- Validation
- Product definition
RF, wireless & analog
Lead RF Architect · Lead Wireless Architect
RF and analog circuit design, wireless front-end architecture, and end-to-end communication solutions — standards-based or custom — delivered by engineers with 20+ years at major semiconductor and telecommunications companies.
Connected medical devices live or die on their radio. We design the link, validate it, and hand it to a production line thirty meters away with the test fixtures already built.
- RF front-end
- Analog design
- Wireless systems
- Custom links
- Production handoff
DSP & signal processing
Senior DSP Architect
Signal-processing algorithms, performance optimization, and system-level validation and tuning for sensing and stimulation platforms — the discipline where a medical device's clinical behavior is actually defined.
- DSP algorithms
- Signal-path optimization
- System validation
- Tuning
Firmware & embedded software
Lead Firmware / Software Architect
Embedded firmware and system software for complex platforms, hardware-software integration, and production-ready software architecture — including the calibration, flashing, and functional-test software your line will run every day.
- Embedded firmware
- HW/SW integration
- Calibration
- Production software
Mechanical, enclosure & DFM
Chief Engineer, Process & R&D
Mechanical design, prototyping, and enclosure engineering; thermal and vibration testing; design-for-manufacturing and process optimization; and the development of the manufacturing test fixtures that make a regulated build repeatable.
- Enclosure engineering
- Thermal & vibration
- DFM
- Process R&D
- Test fixtures
Manufacturing & test
Production engineering team
Full SMT and system assembly, subassembly builds, wiring-harness fabrication, automated burn-in and final test, serialization, labeling and traceability, packaging and logistics, and supplier sourcing with BOM optimization.
Backed by a semiconductor test and failure-analysis lab most small manufacturers simply do not have — when a board fails, root cause happens down the hall, not across an ocean.
- SMT
- System assembly
- Burn-in & ATE
- Traceability
- BOM sourcing
Bring us the hard part.
Whether you need a full ODM program or a single discipline — RF rescue, DFM review, test engineering — start with a conversation.