Capabilities

Silicon to system, under one roof.

Most contract manufacturers assemble what you hand them. DMTech architects the silicon, the radio, the signal path, the firmware, and the mechanicals — then builds and tests the device on the same floor.

  • Silicon & ASIC architecture

    Chief Architect · Lead ASIC Architect

    SoC and ASIC architecture, product definition through silicon validation, and ARM-based system integration for embedded medical platforms. Our architects have led design programs behind profitable multimedia, smartphone, and SSD platforms shipped at scale.

    For a medical device, this means the core of your system is defined by people who will also live with its manufacturing and test consequences — silicon choices made with the production line, ATE program, and BOM in view from day one.

    • SoC architecture
    • ARM integration
    • Silicon bring-up
    • Validation
    • Product definition
  • RF, wireless & analog

    Lead RF Architect · Lead Wireless Architect

    RF and analog circuit design, wireless front-end architecture, and end-to-end communication solutions — standards-based or custom — delivered by engineers with 20+ years at major semiconductor and telecommunications companies.

    Connected medical devices live or die on their radio. We design the link, validate it, and hand it to a production line thirty meters away with the test fixtures already built.

    • RF front-end
    • Analog design
    • Wireless systems
    • Custom links
    • Production handoff
  • DSP & signal processing

    Senior DSP Architect

    Signal-processing algorithms, performance optimization, and system-level validation and tuning for sensing and stimulation platforms — the discipline where a medical device's clinical behavior is actually defined.

    • DSP algorithms
    • Signal-path optimization
    • System validation
    • Tuning
  • Firmware & embedded software

    Lead Firmware / Software Architect

    Embedded firmware and system software for complex platforms, hardware-software integration, and production-ready software architecture — including the calibration, flashing, and functional-test software your line will run every day.

    • Embedded firmware
    • HW/SW integration
    • Calibration
    • Production software
  • Mechanical, enclosure & DFM

    Chief Engineer, Process & R&D

    Mechanical design, prototyping, and enclosure engineering; thermal and vibration testing; design-for-manufacturing and process optimization; and the development of the manufacturing test fixtures that make a regulated build repeatable.

    • Enclosure engineering
    • Thermal & vibration
    • DFM
    • Process R&D
    • Test fixtures
  • Manufacturing & test

    Production engineering team

    Full SMT and system assembly, subassembly builds, wiring-harness fabrication, automated burn-in and final test, serialization, labeling and traceability, packaging and logistics, and supplier sourcing with BOM optimization.

    Backed by a semiconductor test and failure-analysis lab most small manufacturers simply do not have — when a board fails, root cause happens down the hall, not across an ocean.

    • SMT
    • System assembly
    • Burn-in & ATE
    • Traceability
    • BOM sourcing

Bring us the hard part.

Whether you need a full ODM program or a single discipline — RF rescue, DFM review, test engineering — start with a conversation.