The Team

Ten senior architects. Two hundred engineering years.

Products our team has shipped at scale span consumer electronics, wireless, multimedia, and semiconductors — at companies like Sony, behind profitable smartphones, SSDs, and telecom systems. Now that depth builds medical devices.

UC Berkeley · MIT · Stanford · NYU · USC · UCLA · UC Davis · Illinois Tech · Santa Clara · Arizona State

Executive & leadership

DN

Daryn H. Nguyen

Founder & CEO

Serial entrepreneur with 25+ years in ASIC design, electronics manufacturing, and system development. Previously sold his interests in Linkup Systems; senior roles behind high-volume consumer electronics and semiconductor products at Sony (XBR TV Division), Linktronics, and NeoMagic.

B.S.E.E., UC Berkeley
PP

Periklis Papadopoulos, Ph.D.

VP, Business Development

Leads global business development and strategic partnerships, bridging customer requirements with engineering execution for commercial alignment and long-term customer success.

Ph.D., Stanford University
VD

Vincent V. Dinh, Ph.D.

Business Development

20+ years of hardware design and applied engineering experience supporting technical sales, customer solution definition, and ODM program development.

Ph.D., UC Davis

Silicon & system architecture

GT

Garry Tse

Chief Architect

20+ years of semiconductor design leadership; architecture and design programs behind profitable multimedia and smartphone devices, from product definition through silicon validation.

M.S.E.E. NYU · B.S.E.E. USC
YC

Yu Mein Cheung

Lead ASIC Architect

Specialist in SoC and ARM-based system design with extensive experience supporting SSD and embedded platforms, from architecture through silicon bring-up and validation.

M.S.C.S. Santa Clara · B.S.E.E. UC Berkeley
MC

Ming Cheung

Lead RF Architect

Seasoned RF and analog circuit designer with 20+ years delivering wireless solutions — front-end architecture through validation and production handoff — for major semiconductor companies.

M.S.E.E. MIT · B.S.E.E. UCLA

Wireless, DSP & communications

LF

Lee Fung, Ph.D.

Lead Wireless Architect

20+ years of leadership in wireless system design, delivering advanced end-to-end communication solutions in major telecommunications environments, standards-based and custom.

Ph.D. & M.S.E.E. Illinois Tech · B.S.E.E. Toronto
KY

Keji Yick

Senior DSP Architect

DSP expert with 20+ years in wireless signal processing, performance optimization, and system-level validation and tuning.

M.S.E.E. Northern Polytechnic · B.S.E.E. Arizona State
PB

Ping Bao, Ph.D.

Lead Firmware / Software Architect

20+ years designing firmware and software systems for complex embedded platforms — hardware-software integration through production-ready software architecture.

Ph.D., M.S.C.S., B.S.C.S., Northern Polytechnical

Process & production engineering

WT

William M. Toscano, Ph.D.

Chief Engineer, Process & R&D

Leads advanced R&D and process engineering; 20+ years developing design and analysis tools for complex process systems — DFM, process optimization, and production-readiness validation.

Ph.D. M.E. MIT · B.S. M.E. UC Berkeley

Meet them on the floor.

Your first meeting is with an architect, not an account manager. Bring the hard questions.